System and method for processing workpieces
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United States of America Patent
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-
Jan 5, 1988
Grant Date -
N/A
app pub date -
Sep 15, 1986
filing date -
Sep 15, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of processing a plurality of semiconductor wafers from a wafer cassette including a wafer transfer housing and one or more processing chambers. A wafer is removed from its cassette and transported through the transfer housing into one or more processing chambers for etching, deposition or other such operations. The processed wafer is replaced into its cassette after being transported back through the wafer transfer housing.
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