Method for preparing encapsulated cathode material

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United States of America Patent

PATENT NO 4720910
SERIAL NO

07063336

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Abstract

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A method for preparing a cathode material is provided. An insertion compound is ground until small particles of the insertion compound are formed. The insertion compound particles are encapsulated in an electronic and ionic conducting polymer to form the cathode material by using a spray dryer.

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Patent Owner(s)

Patent OwnerAddress
MHB JOINT VENTURE GENERAL PARTNERSHIP OF OH MEAD CORPORATION HOPE & LUNDSGAARD ENGINEERING INCCOURTHOUSE PLAZA NORTHEAST A CORP OF DE DAYTON OH 45463

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rourke, John K Chillicothe, OH 8 201
Schwab, Gerhart Chillicothe, OH 9 409
Shackle, Dale R Springboro, OH 44 1442

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