Interconnect tape for use in tape automated bonding
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United States of America Patent
Stats
-
Jan 26, 1988
Grant Date -
N/A
app pub date -
Jan 31, 1986
filing date -
Jan 31, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved interconnect tape for use in tape automated bonding comprising a carrier member for supporting at least one pattern of interconnect leads. At least one first ring is provided having a plurality of sides with each of the sides supporting the leads extending inwardly of the member. Yieldable portions connecting the ring to the carrier member provide reduced stresses in the leads and reduced thermal dissipation during inner lead bonding.
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