Aluminum circuit to be disconnected and method of cutting the same
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United States of America Patent
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-
Feb 2, 1988
Issued Date -
N/A
app pub date -
Jun 15, 1987
filing date -
Mar 5, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In order to cut a portion of an aluminum interconnection in an aluminum circuit to be disconnected, the aluminum interconnection portion in the region to be cut is covered with a hydrogen-containing silicon nitride film by plasma CVD and is then irradiated with laser beams in an operating sequence consisting of three steps: the first step with relatively low power intensity and long irradiation time duration, the second step with intermediate power intensity and short irradiation time duration and the third step with relatively high power intensity and shortest irradiation time duration.
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