Method for producing electric circuits on a base boad
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United States of America Patent
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Feb 9, 1988
Grant Date -
N/A
app pub date -
Dec 11, 1986
filing date -
Jan 14, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method is described for producing multilayer circuits including a resistor circuit on one side of a copper laminated base board, wherein the base board is etched to provide a plurality of circuits of a first layer, effectively processed with a plating-resistant resist and an electrically conductive copper paste to form a plurality of circuits of a second layer, immersed in a metal plating solution to provide a metal plating layer on the copper paste to thereby form the circuits of the second layer on the circuits of the first layer, coated with an electrically conductive paste to provide a pair of electric terminals between two of the circuits of the second layer, and coated with an electrically resistant resist of a predetermined electric resistance value on a part extended between the two electric terminals.
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