Method for imaging printed circuit board component leads
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United States of America Patent
Stats
-
Mar 1, 1988
Grant Date -
N/A
app pub date -
Mar 19, 1986
filing date -
Mar 19, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention provides a novel system for imaging a component lead on an assembled printed circuit board. The system incorporates a light source for illuminating a substantial portion of a solder pad of the circuit board being inspected. A photoreceptor receives emissions reflected from the illuminated portion of said solder pad and generates an image representative thereof. This photoreceptor is arranged so that passage of a component lead through the component hole occludes or shadows a portion of the solder pad from which the photoreceptor would otherwise receive reflected emissions. The system has application in the testing of printed circuit boards prior to wave soldering.
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