Method for plasma - coating a semiconductor body
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United States of America Patent
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-
Mar 1, 1988
Grant Date -
N/A
app pub date -
Aug 18, 1986
filing date -
Aug 18, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for the plasma coating of a layer of material atop a semiconductor body, said method and apparatus adapted to substantially prevent damage to the semiconductor body by energetic vaporized species developed during the coating process. The invention has particular utility in the high volume fabrication of thin film semiconductor devices and may be readily adapted to provide the transparent conductive electrode of photoresponsive devices in a continuous roll-to-roll deposition process.
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