Apparatus and method for plasma treatment of substrates
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United States of America Patent
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Mar 1, 1988
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N/A
app pub date -
Dec 4, 1985
filing date -
Dec 4, 1985
priority date (Note) -
Expired
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Abstract
An apparatus for substantially uniformly treating a substrate with a microwave plasma consists of a mechanism for simultaneously moving the substrate in two directions relative to the direction of plasma production. In one embodiment, the substrate is simultaneously moved rotationally and translationally. In a second embodiment, the substrate is subjected to planetary motion.
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