Mechanical and electrical assembling device for high-density electronic cards with thermal conduction cooling
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United States of America Patent
Stats
-
Mar 15, 1988
Grant Date -
N/A
app pub date -
Jun 11, 1985
filing date -
Jun 14, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A U shaped electrical assembly device is provided which employs a zero insertion force receptacle on the two parallel arms of the U. The bottom side of the U shaped receptacle has a heat exchanger back piece which uses a slot to receive a thermal conductor employed on the insertable electronic cards which are to be placed within the receptacle.
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