Method of stacking printed circuit boards

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United States of America Patent

PATENT NO 4733461
SERIAL NO

06903568

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for stacking, on a mother board in high density, N printed circuit boards which are formed, respectively, in the same size and shape of a regular N-sided polygon, where N is an integer not less than three. The mother board is provided, at a position corresponding to one side of the regular N-sided polygon, with a first connector, and is provided, at 360/N-degree intervals around the center point of the regular N-sided polygon, with N second connectors for selecting the printed circuit boards. Terminals of a data bus line, and address bus line, and a timing signal line for reading/writing data are arranged in the first connector. Each of the N printed circuit boards is provided, on one face thereof at one side of the regular N-sided polygon, with a third connector, is provided, on the opposite face thereof at an adjacent side to the side having the third connector, with a fourth connector, and further is provided, on both faces thereof penetrating therethrough at positions confronting the N second connectors of the mother board, with N fifth connectors for coupling to the second connectors. Each of the terminals of the fourth connector is connected correspondingly to each of the terminals of the third connector on the board. The N printed circuit boards are stacked on the mother board by rotating, through 360/N degrees, each printed circuit board with respect to the board it is overlying.

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Patent Owner(s)

  • MICRO CO., LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakano, Tsuyoshi Tokyo, JP 73 1207

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