Method for the thermal characterization of semiconductor packaging systems
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United States of America Patent
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-
Mar 29, 1988
Grant Date -
N/A
app pub date -
Mar 9, 1987
filing date -
Mar 9, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for determining the thermal characteristics of a semiconductor packaging system is provided which uses a platinum resistor test unit. The platinum resistor is preferably sized to approximate the dimensions of the semiconductor device for which the package was designed, and is installed within the package. The packaged resistor is then thermally calibrated at a plurality of temperature levels to generate a linear temperature versus resistance graph or equation corresponding thereto. Next, voltage is applied to the packaged resistor causing such resistor to 'self heat.' Its resistance is calculated, and the temperature corresponding thereto is obtained from the graph or equation. Such temperature is the surface temperature of the resistor. This temperature may then be used to calculate the temperature gradient from the inside of the package to any reference point on or near the outside of the package, the temperature of which has been previously determined.
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