Importance

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Abstract

A semiconductor device element, switchable and stable against alternating loads, is provided as an intermediate product which can be stored, can be applied universally, has a semiconductor wafer disposed between two annular insulating bodies and is stabilized on its surface. The semiconductor wafer is connected on two sides via soldering to a contact piece of molybdenum. The contact pieces are provided on their outer surface in each case with a metallization for providing pressure contacting. The semiconductor wafer is covered with a protecting, that is, passivating and stabilizing, covering in the edge zone up to the jacket face of the contact pieces. The edge zone of the semiconductor is immersed in an additional surface stabilizing material in the edge zone between the insulating bodies. The adhesive properties of the surface stabilizing substance mutually connect the insulating bodies and the semiconductor wafer. The contact pieces and the insulating bodies form a sealed enclosure of the semiconductor wafer, and the control electrode of the semiconductor is pressure contacted by a control current conductor held in one of the insulating bodies, which control electrode is formed as a leaf spring.

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First Claim