Method of applying a resist

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United States of America Patent

PATENT NO 4738910
SERIAL NO

06872506

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Abstract

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A photoresist process which comprises a process for spin-coating a substrate with a resist, a process for transferring a mask pattern onto the coated resist film followed by exposure, and a developing process for forming a pattern on the substrate after the pattern has been exposed. When the developed pattern of the resist pulsates with the increase or decrease of parameters in the process for applying resist, the value of the parameter is set to a value that corresponds to an extreme value of the pulsation.

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTDJAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ito, Tetsuo Mito, JP 66 785
Kadota, Kazuya Tokyo, JP 5 102
Kobayashi, Kazunari Tokyo, JP 65 725
Nakagomi, Yoshiyuki Yamanashi, JP 3 64
Tanuma, Masaya Yokohama, JP 2 27

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