
US Patent No: 4,738,910
Number of patents in Portfolio can not be more than 2000
Method of applying a resist
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Apr 19, 1988
Issued date -
Jun 10, 1986
filing date -
06/872,506
serial no -
Expired
status
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Abstract
A photoresist process which comprises a process for spin-coating a substrate with a resist, a process for transferring a mask pattern onto the coated resist film followed by exposure, and a developing process for forming a pattern on the substrate after the pattern has been exposed. When the developed pattern of the resist pulsates with the increase or decrease of parameters in the process for applying resist, the value of the parameter is set to a value that corresponds to an extreme value of the pulsation.
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International Classification(s)
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Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
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| 4,500,615 Wafer exposure method and apparatus | 17 | 1982 | |