High-frequency circuit arrangement and semiconductor device for use in such an arrangement
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United States of America Patent
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Apr 19, 1988
Issued Date -
N/A
app pub date -
Sep 26, 1986
filing date -
Jun 18, 1982
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In a high-frequency circuit arrangement, passive parts of the circuit are realized in a semiconductor body in which active circuit elements of another semiconductor material are located in recesses in the semiconductor body. When the semi-conductor body is at least in part low-ohmic, a reference plane, for example, the ground plane, can extend very close to the elements of the circuit arrangement. Consequently, due to the shorter connections required, parasitic effects are considerably reduced. When only one active element is mounted and only connections for this element are formed on the semiconductor body, a very suitable support for mounting and measurement is obtained.
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