Header for a wafer scale assembly
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United States of America Patent
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-
Apr 19, 1988
Grant Date -
N/A
app pub date -
May 5, 1986
filing date -
May 5, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A header for a wafer scale assembly includes a plurality of pins having end portions connectable to the wafer scale assembly. The end portions lie in a single plane that it substantially parallel to the plane of the wafer scale assembly.
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