Low temperature single step curing polyimide adhesive
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United States of America Patent
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Apr 26, 1988
Issued Date -
N/A
app pub date -
Aug 19, 1987
filing date -
Jun 4, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Disclosed is a silver-filled paste, an electronic assembly comprising a semiconductive device attached to a substrate by said silver-filled paste, and a method of bonding an electronic device to a substrate using said silver-filled paste. The silver-filled paste comprises a silver powder; a resin having the formula: ##STR1## wherein R comprises a divalent linking group; and a solvent for the resin which comprises one or more electron donor groups.
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