Methods and techniques for fabricating foldable printed circuit boards
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United States of America Patent
Stats
-
May 3, 1988
Grant Date -
N/A
app pub date -
Oct 24, 1986
filing date -
Oct 24, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is disclosed a method of fabricating a folded printed circuit board. The method includes the steps of forming first and second apertures in a rigid board along a common line which line is parallel to a side edge of a board then scoring the line to form a break area for said board. The next step includes the formation of terminal areas on each side of the apertures on opposite sides of the line and forming component terminal areas for said board. Automatically inserting said components into said rigid board, while automatically inserting larger diameter wire conductors into said terminal areas to bridge said apertures, breaking the board along the scored line and folding the board with said wires across the apertures forming hinge assemblies for said board.
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