Ceramic combined cover
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 24, 1988
Grant Date -
N/A
app pub date -
Nov 21, 1986
filing date -
Nov 21, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder ring that is tack welded on, or solder paste that is screened onto the base metallization and furnace reflowed.
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Cited Art Landscape
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