Probing apparatus for measuring electrical characteristics of semiconductor device formed on wafer
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United States of America Patent
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May 24, 1988
Grant Date -
N/A
app pub date -
Sep 2, 1986
filing date -
Sep 13, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A probing apparatus is used to measure electrical characteristics of a semiconductor device formed on a wafer. The apparatus includes means for holding the wafer in a vertical or slightly leaned position on a frame, a contact needle, three-directional drive means for holding the needle on the frame movably both vertically and horizontally along the device-bearing surface of the wafer and for bringing the needle into releasable contact with a desired portion of the device-bearing surface of the wafer, and a microscope provided in such a way that the tip of the needle is seen substantially at the center of the field of view, said microscope being movable together with the needle along the device-bearing surface of the wafer.
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