Method of manufacturing an ultrasonic transducer
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 31, 1988
Issued Date -
N/A
app pub date -
Aug 14, 1986
filing date -
Dec 28, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Electrode layers are formed on planes of a plate-shaped piezoelectric element to provide an ultrasonic transducer material. The ultrasonic transducer material is bonded to an electrically insulating substrate by electrically conductive adhesive. A plurality of conductors is provided on the substrate in the array direction and a direction perpendicular to the array direction. A printed circuit is formed on the backside of the substrate to connect the conductors. Notches are cut out in the ultrasonic transducer material to divide it into a plurality of transducer elements arranged in the array direction and a direction perpendicular to the array direction. A ground electrode connects the second electrodes of the ultrasonic transducer elements. The transducer elements are impressed with voltage through the printed circuit and ground electrode to issue ultrasonic waves.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully