Importance

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Abstract

A package for mounting and cooling a high density array of integrated circuit chips includes an interconnection assembly for the IC chips which (1) provides base connections to a printed circuit board (PCB), which is adapted to connect to external signal circuits, and (2) separate peripheral power supply connections. The package also includes a cooling module containing fluid-cooled heat sinks that (a) collectively conform to the array of integrated circuit chips and (b) individually conform to the configuration and orientation of the individual chips. The heat sinks are conformed to the chip orientation independently of the coolant flow, which is established through the heat sinks immediately adjacent the interface. Among other aspects of the package, the interconnection assembly incorporates resilient connectors that provide essentially stress-impervious connections to the integrated circuit chips and to the signal PCB.

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First Claim