Wafer probe head
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 7, 1988
Issued Date -
N/A
app pub date -
Jun 2, 1987
filing date -
Sep 26, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wafer probe head has a plate-form support member having a tip region and a mounting region. At least one electrically conductive probe tip is carried by the support member at the tip region. A connector is carried by the support member at a location spaced from the tip region, and the probe tip is electrically connected to the connector. The probe head also has a strain gauge for measuring physical distortion of the support member as a result of the probe tip being pressed against a device under test by virtue of relative movement between the mounting region of the support member and the device under test.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully