Apparatus for processing wafers and the like
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United States of America Patent
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-
Jun 14, 1988
Grant Date -
N/A
app pub date -
Apr 25, 1986
filing date -
Apr 26, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for processing semiconductor substrates (i.e., wafers) or the like by rotation of the same. The apparatus includes: a housing which defines a processing chamber therein; and an exhaust duct connected to the lower side portion of the chamber. A rotary member is rotatably mounted in the chamber, on which a plurality of wafers to be processed are held. At the upper side portion within the chamber an auxiliary chamber is provided. Undesired objects, such as water remaining on the wafers and vapor and dirts sprung from the wafers, are effectively expelled from the chamber, through both the exhaust duct and the auxiliary chamber.
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