Method of fabricating gold bumps on IC's and power chips
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United States of America Patent
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-
Jun 14, 1988
Grant Date -
N/A
app pub date -
Apr 17, 1986
filing date -
Apr 17, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for depositing gold bumps on metallized pads of semiconductor chips uses a commercially available thermocompression or thermosonic gold wire bonder. The method includes the steps of depositing a gold ball with an attached wire on the metallized pad, and removing the wire so that a gold bump remains on the pad.
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