Method for producing circuit boards
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United States of America Patent
Stats
-
Jun 14, 1988
Issued Date -
N/A
app pub date -
Dec 7, 1983
filing date -
Feb 19, 1980
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for producing circuit boards in which a plurality of planar circuit board bases having a circuit pattern thereon are interconnected at predetermined points. The method includes the steps of applying a mask over the circuit pattern on a base leaving, at the points to be interconnected, a window in the mask; applying an adhesive coating over the mask with the adhesive coating extending over the mask windows and onto the circuit pattern metal to form a second smaller window; treating and depositing metal on said adhesive coating to form a second circuit pattern on the plane of said adhesive and interconnecting the second circuit pattern with the first circuit pattern at said second windows; and, repeating said steps until a circuit board of the desired number of planar circuit patterns is produced.
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