Door closure apparatus for encapsulating a wafer paddle
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United States of America Patent
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Jun 21, 1988
Grant Date -
N/A
app pub date -
Sep 3, 1985
filing date -
Sep 3, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A door closure apparatus for processing a wafer paddle used to support microchips in a process tube using the chemical vapor deposition process. The device has a flexible joint which enables the sealing door to squarely seat against a processing tube whether or not the processing tube is correctly aligned. Further, the device has an adapter which enables paddles with variously shaped handles to be accepted in the standard processing tube as if the handles were round.
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