Decoupling capacitor for leadless surface mounted chip carrier
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United States of America Patent
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Jun 28, 1988
Issued Date -
N/A
app pub date -
Mar 19, 1987
filing date -
Jan 22, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
High frequency noise is decoupled from power supplied to a surface mounted integrated circuit (IC) leadless chip carrier package by installation of a surface mounted decoupling capacitor over the IC chip carrier package and printed circuit board. The decoupling capacitor comprises a dielectric material sandwiched between a pair of conductors and having a plurality of leads extending from each conductor. In accordance with the present invention, the decoupling capacitor is individually dimensioned and configured to fit over a surface mounted integrated circuit (IC) leadless chip carrier package and correspond to the power and ground pin configuration of that package.
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