Low firing temperature ceramic materials
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United States of America Patent
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Jul 5, 1988
Issued Date -
N/A
app pub date -
Oct 19, 1987
filing date -
Apr 18, 1986
priority date (Note) -
Expired
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Abstract
A dense, sintered ceramic material having a low dielectric constant and a low coefficient of thermal expansion is provided from a mixture of 10-50 wt. % alumina, 0-30 wt. % fused silica, and 50-60 wt. % of a frit comprised of CaO, MgO, Al.sub.2 O.sub.3, B.sub.2 O.sub.3, and SiO.sub.2. The mixture has a minimum sintering temperature in the range of 850.degree.-1000.degree. C., and can be formed by conventional manufacturing techniques. It is particularly useful for the fabrication of single or multilayer electronic circuit substrates.
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