Flexible circuit strain relief
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United States of America Patent
Stats
-
Jul 12, 1988
Grant Date -
N/A
app pub date -
Mar 25, 1986
filing date -
Mar 25, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A strain relief system for flexible circuits has a tapered cover laminate affixed to either side of the flexible circuit to form a cover laminate/flexible circuit assembly, with the widest portion of the cover laminate being at the point of maximum bending stress of the flexible circuit to provide a stiffer assembly at that point. A rigid stiffener having a bending radius also is affixed to either side of the cover laminate/flexible circuit assembly at the point of maximum bending stress to provide strain relief, the bending radii being laterally offset from each other so that bending in opposite directions occurs at different locations of the flexible circuit. The result is a gentle, low stress bend in the flexible circuit when subjected to regular bending.
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