Large scale integrated circuit test system
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United States of America Patent
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Jul 26, 1988
Grant Date -
N/A
app pub date -
Jul 30, 1985
filing date -
Jul 30, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A large scale integrated circuit package and test assembly wherein a chip is mounted on an insulating package substrate, and the package substrate is easily demountably connectable on a circuit test board. An alignment and electrical connector member bridges between the substrate conductors and the printed circuit board conductors. An elastomeric member is aligned over the alignment and electrical connector and compressed by a cover plate to make the electrical connection between the substrate and the printed circuit board. A plurality of such circuit package can be mounted upon a large area test board, and each of the individual circuit packages can be tested during system analysis.
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