Flip-chip pressure transducer
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United States of America Patent
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-
Aug 9, 1988
Grant Date -
N/A
app pub date -
Apr 8, 1985
filing date -
Apr 8, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a pressure transducer comprising a pressure sensitive silicon die having a front side exposing piezoresistive means and comprising means for flip-chip mounting the die to a pressure vessel. The transducer further comprises a pressure vessel having an aperture, the pressure vessel comprising means for flip-chip mounting the die over the aperture. The die is flip-chip mounted over the aperture in the pressure vessel, and there is a hermetic seal between the pressure vessel and the die.
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