Packaging system for multiple semiconductor devices
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United States of America Patent
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-
Aug 9, 1988
Issued Date -
N/A
app pub date -
Nov 4, 1987
filing date -
Aug 8, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved high density packaging system for interconnecting integrated circuit devices includes a tin alloy lead frame sandwiched between two multi-layer glass/epoxy substrates encapsulated in an injection molded plastic/epoxy package. Integrated circuit devices are mounted on the top of the upper substrate and on the bottom of the lower substrate to provide increased packaging density.
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