Soldering apparatus
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United States of America Patent
Stats
-
Aug 16, 1988
Grant Date -
N/A
app pub date -
Feb 25, 1987
filing date -
Feb 25, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A soldering apparatus includes a solder bath 40 and a component holder 43 positioned to lower an exposed tag of a component to contact solder in the solder bath 40. After removal from the bath the component is deliberately subjected to a mechanical shock when a limb of a bracket 44 strikes a turret plate 42 under the action of a spring 46. The shock causes a short time vibration in the component and spreads solder in tears which naturally form on the exposed tags to remove or substantially reduce those tears.
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Cited Art Landscape
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