Wafer probe

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United States of America Patent

PATENT NO 4764723
SERIAL NO

06928987

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A wafer probe for testing semiconductor devices brings low impedance connections closely adjacent device bonding pads for bypassing power supply voltages.

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Patent Owner(s)

Patent OwnerAddress
CASCADE MICROTECH INC2430 NW 206TH AVENUE BEAVERTON OR 97006

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Strid, Eric W Portland, OR 33 2095

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