Method of packing electronic parts and a pack produced by the method

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United States of America Patent

PATENT NO 4767004
SERIAL NO

07139167

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In this method of packing electronic parts electronic parts are inserted into a plurality of containers each of which has an opening on the upper surface thereof. These containers are juxtaposed side by side. A single common pressing plate is disposed over the containers so as to cover their openings. The containers and pressing plate are packed together in a sack under vacuum.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU LIMITED1-1 KAMIKODANAKA 4-CHOME NAKAHARA-KU KAWASAKI-SHI KANAGAWA 211-8588

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishihara, Michio Yokohama, JP 3 42
Kuboyama, Makoto Yokohama, JP 4 47
Oishi, Hiroshi Aizuwakamatsu, JP 82 922

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