Solder mounting of electrical contacts
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United States of America Patent
Stats
-
Aug 30, 1988
Issued Date -
N/A
app pub date -
Sep 28, 1987
filing date -
Aug 22, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electrical component having an elongated contact element provided with a premeasured bead of solder thereon such that, in reflow operation, it can be joined to a contact on another component. In one embodiment, the solder bead can be formed on the pins of a component adapted for mounting on a printed circuit board. In another embodiment, the solder bead is formed on a finger contact of a plug connector adapted to engage a surface contact on an associated daughter board. For both embodiments, the bead is formed by using a mold which assures that each bead contains a uniform amount of solder. The construction enables mixed technology to be mounted on a printed circuit board with both pin mounted components and surface mounted components to be mounted simultaneously in a reflow operation. The entire process resulting in the novel electrical component and in a device incorporating the novel electrical component is also disclosed.
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