Importance

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Abstract

A system is disclosed for the production of a number of disk-shaped semiconductor bodies from a large face contacted semiconductor starting chip, which is attached to a carrier plate, where in several steps simultaneous treatment of all semiconductor bodies in the set is obtained and where in further steps an individual treatment occurs. This method is improved by connecting the semiconductor component bodies generated by dicing of the starting chip to a foil-like structure with the aid of a silicone rubber with particular properties. A device for supporting the structure and for further treatment of the therein mechanically stable supported semiconductor device element is attached with silicon rubber to the structure before detaching of the starting disk. This support means is detached jointly with the structure from the carrier plate. The structure of semiconductor component elements and silicone rubber attached to the support means is subjected to further processing steps including at least some measurements, and thereupon the semiconductor components elements are separated. A defined edge profile is generated at the sections forming semiconductor component elements, for example by etching or sandblasting within the process of dicing the starting semiconductor chip.

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First Claim