Method for making electrically programmable memory device by doping the floating gate by implant
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 6, 1988
Issued Date -
N/A
app pub date -
Apr 17, 1986
filing date -
Nov 28, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In the present invention, asperity in the floating gate of an EPROM or EEPROM device is reduced. An improved process for fabricating ultrahigh coupling interpoly isolation dielectrics comprising a structure of oxide-nitride-oxide is disclosed. The first oxide is grown on undoped LPCVD polycrystalline silicon (polysilicon) to reduce the grain boundary-oxidation enhancement effect at the interface of floating gate polysilicon and interpoly oxide. This results in much higher breakdown capability of interpoly dielectrics. As a consequence, the shrinkage of the interpoly electrical thickness to an extent far beyond current limitation becomes possible. Implanted dopants through interpoly oxide into the floating gate polysilicon also eliminate the oxidation enhanced diffusion from conventional POCl.sub.3 doped polysilicon into tunnel oxide. The phosphorus induced trap in the tunnel oxide region are reduced. The EEPROM threshold window can remain open beyond 10.sup.6 cycles.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully