Method for forming on a nonconductor a shielding layer against electromagnetic radiation
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 13, 1988
Grant Date -
N/A
app pub date -
Dec 30, 1986
filing date -
Dec 30, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This invention provides a method for forming metallic deposits on a nonconductor to provide a shield against electromagnetic radiation, the method comprising the steps of: (i) subjecting the surface of a nonconductor to pretreatment prior to electroless copper plating, (ii) electrolessly plating the pretreated surface of nonconductor with copper to form a copper layer about 0.5 to about 20 .mu.m in thickness on the surface, and (iii) immersing the copper-coated nonconductor in an electroless Ni plating solution and passing an electric current through the solution with the copper layer serving as the cathode, followed by cutting of current, to deposit as Ni layer 1.0 to about 20 .mu.m on the copper layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully