Method of enclosing an object
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United States of America Patent
Stats
-
Sep 13, 1988
Grant Date -
N/A
app pub date -
Apr 15, 1987
filing date -
Apr 16, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of enclosing an object, such as an electronic component, within a homogeneous block of microporous thermal insulation material comprises charging a first predetermined amount of a loose microporous thermal insulation mixture into a die and compacting the insulation mixture into a block for supporting the object to be insulated. A recess may be formed in the compacted mixture for receiving the object. The object is then located on the compacted mixture and a second predetermined amount of loose microporous thermal insulation mixture is charged into the die. The loose insulation mixture is compacted against the block of already compacted insulation material which causes the two charges of insulation mixture to merge and to form a homogeneous block enclosing the object.
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