Modular interface for monolithic millimeter wave antenna array
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United States of America Patent
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Sep 13, 1988
Grant Date -
N/A
app pub date -
Sep 10, 1986
filing date -
Sep 10, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A signal interface/package for MMIC components comprises a laminate of RF chips, socket carrier, wiring board and cold plate/waveguide structure. Input/output pins of the chip modules interface with feed-through connectors of the carrier. Each chip module is formed of a ceramic substrate which rests atop a heat conductive metallic baseplate. RF coupling ports extend through the baseplate. A coldplate element has a plurality of depressions and pillars, with each depression conforming with the shape of the baseplate. Printed wiring boards contain interconnect wiring layers to connect the signal pins to the outside world. The bottom surface of the coldplate defines a waveguide cavity structure.
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