Multilayer circuit prototyping board
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United States of America Patent
Stats
-
Sep 20, 1988
Grant Date -
N/A
app pub date -
Feb 9, 1987
filing date -
Feb 9, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer circuit prototyping board for prototyping circuits in a three-layer transmission line structure. The multilayer circuit prototyping board includes grooves and mesas on one side thereof, with wires to be run in the grooves for interconnecting electronic components. The electronic components are mounted on the bottom surface of the prototyping boards with leads protruding through holes in a bottom ground plane into the grooved portions. Wires or solder bridges are located within the grooves for interconnecting the leads of the various electronic components. A removable top ground plane is then placed atop the board base for completing the three-layer structure.
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