Multilayer PC board using polymer thick films
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United States of America Patent
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-
Oct 4, 1988
Grant Date -
N/A
app pub date -
Apr 3, 1987
filing date -
Apr 3, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer printed circuit board which reliably and economically marries conventional copper clad printed circuit board technology with polymeric conductors and insulators. Reliability is enhanced by forming all solder pads of copper, providing conductive tails on solder pads which are to be connected by polymeric inks, and ultimately forming a solder resist over all but the solder pads. As a result, polymer inks can be applied to both sides of the board, and the completed board can be subject to conventional solder dipping or wave soldering operations. According to one feature of the invention, a thin dielectric layer can be applied as intermediate to planar conductive layers which form a power plane having built-in distributed capacitance for decoupling.
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