Microelectronic burn-in system
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United States of America Patent
Stats
-
Oct 11, 1988
Issued Date -
N/A
app pub date -
Mar 9, 1987
filing date -
Oct 3, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for use in thermally testing electrical components, especially microelectronic components, such as dual in-line integrated circuit packages is disclosed. The apparatus is for use in testing the electrical performance of components when subjected to elevated temperature. Heat is applied through resistive heating elements disposed adjacent the electrical components which are mounted in electrical connectors, such as DIP sockets. Separate test and heater printed circuit boards attachable to conventional edge connectors can be employed. Insulation completely surrounds the sockets and the electrical components. Heating elements having a ferromagnetic-nonferromagnetic layer construction and exhibiting constant temperature regulation at a characteristic Curie point can be employed.
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