Leadform for use with surface mounted components
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United States of America Patent
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-
Oct 11, 1988
Issued Date -
N/A
app pub date -
Nov 17, 1987
filing date -
Oct 16, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved leadform for use with surface mount components is described. The improved leadform provides a connection to a printed circuit substrate which is highly resistant to stress related failures. The leadform is configured so that the connection utilizes a relatively greater area of the leadform for contact with a solder connection resulting in a more compliant connection. In addition, the present invention provides a preparation for the printed circuit media which allows the substrate media to absorb stresses which occur due to thermal cycling.
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