Method and means for handling semiconductor and similar electronic devices
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United States of America Patent
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-
Oct 18, 1988
Grant Date -
N/A
app pub date -
May 24, 1983
filing date -
May 24, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Method and apparatus for handling semiconductor chips and the like are disclosed which include the use of a flat flexible film which is attached to the face of a base member. The face of the base member is formed with recesses covered by the flat flexible film. Chips are loaded onto the flat flexible film in good surface contact therewith whereby they are securely held in position by interfacial, adhesive, or other forces between the chips and film. To facilitate removal of chips from the film, the recesses are connected to a vaccuum source, drawing portions of the flexible film into said recesses and providing the film with a texturized, or undulating, surface. The area of contact between the chips and film is thereby reduced which, in turn, results in a reduction in the force by which the chips are attached to the film, thereby enabling removal of the chips by conventional techniques.
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