High heat conductive insulated substrate and method of manufacturing the same

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United States of America Patent

PATENT NO 4783368
SERIAL NO

06927211

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Abstract

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An insulated substrate having high thermal conductivity comprising a substrate having a thermal conductivity of not less than 50 W/m.k., and an insulating layer having high thermal conductivity coated on the substrate; and a method of producing the insulated substrate characterized in that an insulating layer is formed on a substrate by applying DC voltage and RF power to the substrate and providing a magnetic field parallel to the surface of the substrate. The insulated substrate has good heat conductivity, thermal resistance and smooth surface, whereby exfoliation can be prevented.

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Patent Owner(s)

Patent OwnerAddress
KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA 2-4 NAKANOSHIMA 3-CHOME KITA-KU OSAKA-SHI JAPANNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakayama, Takehisa Kobe, JP 18 263
Tawada, Yoshihisa Kobe, JP 54 899
Yamamoto, Kenji Kobe, JP 641 5047

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