Multichip integrated circuit packaging configuration and method
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United States of America Patent
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Nov 8, 1988
Grant Date -
N/A
app pub date -
Sep 26, 1986
filing date -
Sep 26, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multichip integrated circuit package comprises a substrate to which is affixed one or more integrated circuit chips having interconnection pads. A polymer film overlying and bridging integrated circuit chips present is provided with a plurality of via openings to accommodate a layer of interconnection metallization which serves to connect various chips and chip pads within the interconnection pads disposed on the chips. A significant advantage of the packaging method and configuration of the present invention is the ability for the polymer film to be removed. This significantly improves testability and effectively provides wafer scale integration circuit packages which are free of problems associated with yield and testability.
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