Importance

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Abstract

An improved test apparatus is disclosed for testing leadless IC chip carriers or IC dies. The apparatus employs a flexible film on which is imprinted a conductor line pattern terminated in a plurality of raised conductive pads. The line pattern is readily formed on the film surface using photolithographic techniques. The conductive pads are arranged on the film surface in such a way as to conform to the positioning of the edge contact terminals of the chip carrier. A frame structure is provided for resiliently urging the chip carrier against the surface of the film, with the edge terminals of the chip carrier in electrical contact with the raised pads on the film. The conductor lines on the film are also terminated in raised pads, which are urged against a printed wire pattern on a rigid circuit board, which provides connections to the chip carrier test equipment. Thus, electrical contact is made to the chip carrier without the use of wire bonds or solder connections.

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First Claim