Manufacturing miniature hearing aid having a multi-layer circuit arrangement
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United States of America Patent
Stats
-
Nov 8, 1988
Grant Date -
N/A
app pub date -
Nov 12, 1987
filing date -
Nov 18, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
As opposed to standard circuit board fabrication techniques, whereby plated holes are commonly bored through all the layers of a multilayer board, the circuit board for a hearing aid according to the invention is fabricated by alternatingly forming plated holes in subpackets of the circuit board and then joining together the subpackets until the completed multilayer board is bonded together. The circuit board can be provided with plated internal holes, plated blind holes as well as standard through holes. An especially high component density on the two surfaces of the circuit board is acheived, as well as the fabrication of extremely thin and flexible multilayer circuit boards.
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